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938 Registros

Parte	Fabricante	Descripción	MOQ		Valores	Acción
HSE-B2111-038	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF RFQ	18,595 lang_0935	Obtener cotización
HSS-B20-NP-12	CUI Devices	HEATSINK TO-220 6.8W ALUMINUM	1	PDF RFQ	45,546 lang_0935	Obtener cotización
HSB02-101007	CUI Devices	HEAT SINK, BGA, 10 X 10 X 7 MM	1	PDF RFQ	5,833 lang_0935	Obtener cotización
HSB03-141406	CUI Devices	HEAT SINK, BGA, 14 X 14 X 6 MM	1	PDF RFQ	13,638 lang_0935	Obtener cotización
HSB10-232306	CUI Devices	HEAT SINK, BGA, 23 X 23 X 6 MM	1	PDF RFQ	43,316 lang_0935	Obtener cotización
HSB08-212106	CUI Devices	HEAT SINK, BGA, 21 X 21 X 6 MM	1	PDF RFQ	29,723 lang_0935	Obtener cotización
HSB12-272706	CUI Devices	HEAT SINK, BGA, 27 X 27 X 6 MM	1	PDF RFQ	15,020 lang_0935	Obtener cotización
HSS10-B20-P40	CUI Devices	HEAT SINK, STAMPING, TO-220, 29.	1	PDF RFQ	28,469 lang_0935	Obtener cotización
HSB03-121218	CUI Devices	HEAT SINK, BGA, 12 X 12 X 18 MM	1	PDF RFQ	9,616 lang_0935	Obtener cotización
HSB09-212115	CUI Devices	HEAT SINK, BGA, 21 X 21 X 15 MM	1	PDF RFQ	31,722 lang_0935	Obtener cotización

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